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Open architecture multi-beam EBL for sub-10nm sovereign chip manufacturing

An open, mask-free, multi-vendor architecture for mature-node semiconductor manufacturing โ€” published, simulated, and software-defined.

Release: v5 (May 16, 2026) โ€” final integrated open-source release with full software stack (GDS-II pattern compiler, real-time control firmware, tool operating system) layered on top of the v4.1 hardware engineering.

Author: Robert Gerald Morin (NรŽKI Nation Builders, Edmonton AB, Canada) ORCID: 0009-0008-8373-1496 Correspondence: robmorin0@gmail.com License: papers under CC BY 4.0 ยท code under MIT (see LICENSE.papers , LICENSE.code )

Morin, R. G. (2026). Multi-Beam Direct-Write Electron Lithography via Multi-Rate Electromagnetic Steering โ€” v5 Open Architecture Release. Zenodo. https://doi.org/10.5281/zenodo.20247262

A complete open-source design package for a multi-beam direct-write electron-beam lithography (EBL) machine. It targets mature-node semiconductor manufacturing (50โ€“180 nm range) at roughly 10ร— lower capital cost than EUV (~$37 M per tool vs $200โ€“400 M), with no single-vendor architectural dependency .

The architecture is released under CC BY 4.0 (papers) + MIT (code). The author makes no patent claim on anything in this package. By publication, the entire design enters the public domain as prior art and may not be enclosed by subsequent IP filings by any party.